DU1P0
DU1P0
DU1P0

FEATURES
• 1 WATT UNREGULATED OUTPUT POWER
• OUTPUT CURRENT UP TO 0.2A
• SINGLE -IN-LINE PACKAGE (SIP)
• HIGH EFFICIENCY FOR LOW POWER APPLICATION
• INPUT RANGE FROM 4.5VDC TO 5.5VDC, 10.8VDC TO 13.2 VDC,
13.5VDC TO 16.5VDC AND 21.6VDC TO 26.4VDC
• UL 94-V0 NON-CONDUCTED CASE
• INTERNAL INPUT & OUTPUT FILTER
• INPUT TO OUTPUT ISOLATION UP:3kVDC, MIN.
• SUFFIX-N ISOLATION LEVEL REINFORCE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Measurement Equipment
• Semiconductor Equipment

$1.00
DUR01
DUR01
DUR01

FEATURES
• 1 WATT UNREGULATED OUTPUT POWER
• OUTPUT CURRENT UP TO 303mA
• 4 PIN SINGLE-IN-LINE PACKAGE (SIP)
• HIGH EFFICIENCY FOR LOW POWER APPLICATION
• INPUT RANGE FROM 3.0VDC TO 3.6VDC, 4.5VDC TO 5.5VDC,
10.8VDC TO 13.2VDC, 13.5VDC TO 16.5VDC AND 21.6VDC TO 26.4VDC
• UL 94-V0 NON-CONDUCTED CASE
• INTERNAL INPUT & OUTPUT FILTER
• INPUT / OUTPUT ISOLATION UP TO 1KVDC
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• Wireless Network
• Telecom/Datacom
• Industry Control System
• Measurement Equipment
• Semiconductor Equipment

$1.00
PDH02
PDH02
PDH02

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$2.00
PDH02W
PDH02W
PDH02W

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$2.00
PDH03
PDH03
PDH03

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$3.00
PDH03W
PDH03W
PDH03W

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.74 X 0.50 X 0.33 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$3.00
PDL02
PDL02
PDL02

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.86 X 0.36 X 0.44 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$2.00
PDL03
PDL03
PDL03

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.86 X 0.36 X 0.44 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$3.00
PDL03W
PDL03W
PDL03W

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.86 X 0.36 X 0.44 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$3.00
PDL06
PDL06
PDL06

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.86 X 0.36 X 0.44 INCH
• LOW OUTPUT RIPPLE AND NOISE
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$6.00
PDL06W
PDL06W
PDL06W

FEATURES
• NO MINIMUM LOAD REQUIRED
• UP TO 3000VDC INPUT TO OUTPUT ISOLATION
• SMALL SIZE AND LOW PROFILE:0.86 X 0.36 X 0.44 INCH
• UL60950-1, EN60950-1, & IEC60950-1 SAFETY APPROVALS
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• DISTRIBUTED POWER ARCHITECTURES
• SEMICONDUCTOR EQUIPMENT

$6.00
SDH01
SDH01
SDH01

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT

$1.00
SDH01W
SDH01W
SDH01W

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT

$1.00
SDH02
SDH02
SDH02

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT

$1.00
SDH02W
SDH02W
SDH02W

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT

$1.00
SDS02W
SDS02W
SDS02W

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• SMD PACKAGE QUALIFIED FOR LEADFREE REFLOW SOLDER PROCESS
ACCORDING IPC J-STD-020D
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT

$1.00
SDS03W
SDS03W
SDS03W

FEATURES
• ULTRA SMALL SMD AND DIP PACKAGE, 0.52 x 0.36x 0.40 INCH WITH REGULATED
• NO MINIMUM LOAD REQUIRED
• CONTINUOUS SHORT CIRCUIT PROTECTION
• 1600VDC INPUT TO OUTPUT ISOLATION AND 3000VDC FOR OPTION
• SAFETY MEETS UL60950-1, EN60950-1, & IEC60950-1
• CE MARKED
• COMPLIANT TO RoHS II & REACH

APPLICATIONS
• WIRELESS NETWORK
• TELECOM/DATACOM
• INDUSTRY CONTROL SYSTEM
• MEASUREMENT EQUIPMENT
• SEMICONDUCTOR EQUIPMENT

$1.00